Item type |
学位論文 / Thesis or Dissertation(1) |
公開日 |
2021-04-23 |
本文言語 |
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言語 |
eng |
タイトル |
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タイトル |
Enhanced Osseointegration and Bio-Decontamination of Nanostructured Titanium Based on Non-Thermal Atmospheric Pressure Plasma |
著者 |
曾, 昱豪
Zeng, Yuhao
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キーワード |
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主題Scheme |
Other |
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主題 |
osseointegration|biofilm inhibition| non-thermal plasma treatment |
資源タイプ |
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資源タイプ識別子 |
http://purl.org/coar/resource_type/c_db06 |
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資源タイプ |
doctoral thesis |
アクセス権 |
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アクセス権 |
open access |
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アクセス権URI |
http://purl.org/coar/access_right/c_abf2 |
抄録 |
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内容記述タイプ |
Abstract |
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内容記述 |
Alkali-treated titanate layer with nanonetwork structures (TNS) is a promising surface for improving osseointegration capacity in implants. Nevertheless, there is a risk of device failure as a result of insu_cient resistance to biofilm contamination. This study tested whether treatment using a handheld non-thermal plasma device could e_ciently eliminate biofilm contamination without destroying the surface nanostructure while re-establishing a surface that promoted new bone generation. TNS specimens were treated by a piezoelectric direct discharge (PDD) plasma generator.The evaluation of initial cell attachment with adhesion images, alkaline phosphatase activity, extracellular matrix mineralization, and expression of genes related to osteogenesis was performed using rat bone marrow mesenchymal stem cells, and the bone response were evaluated in vivo using a rat femur model. Nanotopography and surface roughness did not significantly di_er before and after plasma treatments. Cell and bone formation activity were improved by TNS plasma treatment. Furthermore, plasma treatment e_ectively eliminated biofilm contamination from the surface. These results suggested that this plasma treatment may be a promising approach for the treatment of nanomaterials immediately before implantation and a therapeutic strategy for peri-implantitis. |
学位名 |
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学位名 |
博士(歯学) |
学位授与機関 |
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学位授与機関識別子Scheme |
kakenhi |
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学位授与機関識別子 |
34408 |
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学位授与機関名 |
大阪歯科大学 |
学位授与年月日 |
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学位授与年月日 |
2021-03-05 |
学位授与番号 |
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学位授与番号 |
甲第914号 |